High speed Integrated Circuit Technology

High speed Integrated Circuit Technology

This book reviews the state of the art of very high speed digital integrated circuits.

Author: Mark J. W. Rodwell

Publisher: World Scientific

ISBN: 9789810246389

Category: Technology & Engineering

Page: 362

View: 126

This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology.
Categories: Technology & Engineering

High speed Integrated Circuit Technology

High speed Integrated Circuit Technology

International Journal of High Speed Electronics and Systems , Vol . ... InP based HBT IC technology is ideal for these applications because only InP based ...

Author: Mark J. W. Rodwell

Publisher: World Scientific

ISBN: 9812810013

Category: Technology & Engineering

Page: 372

View: 106

This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology. Contents: Preface (M J W Rodwell); High-Speed and High-Data-Bandwidth Transmitter and Receiver for Multi-Channel Serial Data Communication with CMOS Technology (M Fukaishi et al.); High-Performance Si and SiGe Bipolar Technologies and Circuits (M Wurzer et al.); Self-Aligned Si BJT/SiGe HBT Technology and Its Application to High-Speed Circuits (K Washio); Small-Scale InGaP/GaAs Heterojunction Bipolar Transistors for High-Speed and Low-Power Integrated-Circuit Applications (T Oka et al.); Prospects of InP-Based IC Technologies for 100-Gbit/S-Class Lightwave Communications Systems (T Enoki et al.); Scaling of InGaAs/InAlAs HBTs for High Speed Mixed-Signal and mm-Wave ICs (M J W Rodwell); Progress Toward 100 GHz Logic in InP HBT IC Technology (C H Fields et al.); Cantilevered Base InP DHBT for High Speed Digital Applications (A L Gutierrez-Aitken et al.); RSFQ Technology: Physics and Devices (P Bunyk et al.); RSFQ Technology: Circuits and Systems (D K Brock). Readership: Researchers, industrialists and academics in electrical and electronic engineering.
Categories: Technology & Engineering

High Performance Integrated Circuit Design

High Performance Integrated Circuit Design

This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs.

Author: Emre Salman

Publisher: McGraw Hill Professional

ISBN: 9780071635769

Category: Technology & Engineering

Page: 736

View: 610

The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise
Categories: Technology & Engineering

On Chip Inductance in High Speed Integrated Circuits

On Chip Inductance in High Speed Integrated Circuits

It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits.

Author: Yehea I. Ismail

Publisher: Springer

ISBN: 1461356776

Category: Technology & Engineering

Page: 303

View: 551

The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Categories: Technology & Engineering

High Frequency Integrated Circuits

High Frequency Integrated Circuits

A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical ...

Author: Sorin Voinigescu

Publisher: Cambridge University Press

ISBN: 9780521873024

Category: Technology & Engineering

Page: 902

View: 956

A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
Categories: Technology & Engineering

Power Distribution Networks in High Speed Integrated Circuits

Power Distribution Networks in High Speed Integrated Circuits

This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.

Author: Andrey Mezhiba

Publisher: Springer Science & Business Media

ISBN: 9781461503996

Category: Technology & Engineering

Page: 280

View: 631

Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.
Categories: Technology & Engineering

On Chip Inductance in High Speed Integrated Circuits

On Chip Inductance in High Speed Integrated Circuits

It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits.

Author: Yehea I. Ismail

Publisher: Springer Science & Business Media

ISBN: 079237293X

Category: Computers

Page: 303

View: 811

The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuits is full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. emOn-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Categories: Computers

Ultra High Speed CMOS Circuits

Ultra High Speed CMOS Circuits

This book also covers a device-oriented circuit design technique that is essential for ultra high speed circuits and gives some examples of device/circuit co-design that can be used for mm-wave technology.

Author: Sam Gharavi

Publisher: Springer Science & Business Media

ISBN: 1461403057

Category: Technology & Engineering

Page: 106

View: 912

The book covers the CMOS-based millimeter wave circuits and devices and presents methods and design techniques to use CMOS technology for circuits operating beyond 100 GHz. Coverage includes a detailed description of both active and passive devices, including modeling techniques and performance optimization. Various mm-wave circuit blocks are discussed, emphasizing their design distinctions from low-frequency design methodologies. This book also covers a device-oriented circuit design technique that is essential for ultra high speed circuits and gives some examples of device/circuit co-design that can be used for mm-wave technology.
Categories: Technology & Engineering

Very High Speed Integrated Circuit VHSIC Technology for Electro optic Applications

Very High Speed Integrated Circuit  VHSIC  Technology for Electro optic Applications

The conventional integrated circuit technology is frequency limited , and
conventional RF technology is cost - ineffective . The development and
application of a high speed , monolithic microcircuit technology and the proper
use of other new ...

Author: John T. Hall

Publisher: Society of Photo Optical

ISBN: UCSD:31822010092815

Category: Technology & Engineering

Page: 118

View: 873

Categories: Technology & Engineering

GaAs High Speed Devices

GaAs High Speed Devices

The fifth part of the book progresses to an up-to-date discussion of heterostructure field-effect (HEMT in chapter 9), potential-effect (HBT in chapter 10), and quantum-effect devices (chapters 11 and 12), all of which are certain to have a ...

Author: C. Y. Chang

Publisher: John Wiley & Sons

ISBN: 047185641X

Category: Technology & Engineering

Page: 612

View: 190

The performance of high-speed semiconductor devices—the genius driving digital computers, advanced electronic systems for digital signal processing, telecommunication systems, and optoelectronics—is inextricably linked to the unique physical and electrical properties of gallium arsenide. Once viewed as a novel alternative to silicon, gallium arsenide has swiftly moved into the forefront of the leading high-tech industries as an irreplaceable material in component fabrication. GaAs High-Speed Devices provides a comprehensive, state-of-the-science look at the phenomenally expansive range of engineering devices gallium arsenide has made possible—as well as the fabrication methods, operating principles, device models, novel device designs, and the material properties and physics of GaAs that are so keenly integral to their success. In a clear five-part format, the book systematically examines each of these aspects of GaAs device technology, forming the first authoritative study to consider so many important aspects at once and in such detail. Beginning with chapter 2 of part one, the book discusses such basic subjects as gallium arsenide materials and crystal properties, electron energy band structures, hole and electron transport, crystal growth of GaAs from the melt and defect density analysis. Part two describes the fabrication process of gallium arsenide devices and integrated circuits, shedding light, in chapter 3, on epitaxial growth processes, molecular beam epitaxy, and metal organic chemical vapor deposition techniques. Chapter 4 provides an introduction to wafer cleaning techniques and environment control, wet etching methods and chemicals, and dry etching systems, including reactive ion etching, focused ion beam, and laser assisted methods. Chapter 5 provides a clear overview of photolithography and nonoptical lithography techniques that include electron beam, x-ray, and ion beam lithography systems. The advances in fabrication techniques described in previous chapters necessitate an examination of low-dimension device physics, which is carried on in detail in chapter 6 of part three. Part four includes a discussion of innovative device design and operating principles which deepens and elaborates the ideas introduced in chapter 1. Key areas such as metal-semiconductor contact systems, Schottky Barrier and ohmic contact formation and reliability studies are examined in chapter 7. A detailed discussion of metal semiconductor field-effect transistors, the fabrication technology, and models and parameter extraction for device analyses occurs in chapter 8. The fifth part of the book progresses to an up-to-date discussion of heterostructure field-effect (HEMT in chapter 9), potential-effect (HBT in chapter 10), and quantum-effect devices (chapters 11 and 12), all of which are certain to have a major impact on high-speed integrated circuits and optoelectronic integrated circuit (OEIC) applications. Every facet of GaAs device technology is placed firmly in a historical context, allowing readers to see instantly the significant developmental changes that have shaped it. Featuring a look at devices still under development and device structures not yet found in the literature, GaAs High-Speed Devices also provides a valuable glimpse into the newest innovations at the center of the latest GaAs technology. An essential text for electrical engineers, materials scientists, physicists, and students, GaAs High-Speed Devices offers the first comprehensive and up-to-date look at these formidable 21st century tools. The unique physical and electrical properties of gallium arsenide has revolutionized the hardware essential to digital computers, advanced electronic systems for digital signal processing, telecommunication systems, and optoelectronics. GaAs High-Speed Devices provides the first fully comprehensive look at the enormous range of engineering devices gallium arsenide has made possible as well as the backbone of the technology—ication methods, operating principles, and the materials properties and physics of GaAs—device models and novel device designs. Featuring a clear, six-part format, the book covers: GaAs materials and crystal properties Fabrication processes of GaAs devices and integrated circuits Electron beam, x-ray, and ion beam lithography systems Metal-semiconductor contact systems Heterostructure field-effect, potential-effect, and quantum-effect devices GaAs Microwave Monolithic Integrated Circuits and Digital Integrated Circuits In addition, this comprehensive volume places every facet of the technology in an historical context and gives readers an unusual glimpse at devices still under development and device structures not yet found in the literature.
Categories: Technology & Engineering

Design of High speed Communication Circuits

Design of High speed Communication Circuits

This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible.

Author: Ramesh Harjani

Publisher: World Scientific

ISBN: 9789812774583

Category: Electric circuits

Page: 222

View: 652

MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible. The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O. Contents: Achieving Analog Accuracy in Nanometer CMOS (M P Flynn et al.); Self-Induced Noise in Integrated Circuits (R Gharpurey & S Naraghi); High-Speed Oversampling Analog-to-Digital Converters (A Gharbiya et al.); Designing LC VCOs Using Capacitive Degeneration Techniques (B Jung & R Harjani); Fully Integrated Frequency Synthesizers: A Tutorial (S T Moon et al.); Recent Advances and Design Trends in CMOS Radio Frequency Integrated Circuits (D J Allstot et al.); Equalizers for High-Speed Serial Links (P K Hanumolu et al.); Low-Power, Parallel Interface with Continuous-Time Adaptive Passive Equalizer and Crosstalk Cancellation (C P Yue et al.). Readership: Technologists, scientists, and engineers in the field of high-speed communication circuits. It can also be used as a textbook for graduate and advanced undergraduate courses.
Categories: Electric circuits

Design of Integrated Circuits for Optical Communications

Design of Integrated Circuits for Optical Communications

The Second Edition of this bestselling textbook has been fully updated with: A tutorial treatment of broadband circuits for both students and engineers New and unique information dealing with clock and data recovery circuits and ...

Author: Behzad Razavi

Publisher: John Wiley & Sons

ISBN: 9781118336946

Category: Technology & Engineering

Page: 424

View: 108

"The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. This book deals with the design of high-speed integrated circuits for optical communicationtransceivers.Building upon a detailed understanding of optical devices, the book describes the analysis and design of critical building blocks, such as transimpedance and limiting amplifiers, laser drivers, phase-locked loops, oscillators, clock and datarecovery circuits, and multiplexers.This second edition of this best selling textbook has been updated to provide information on the latest developments in the field"--
Categories: Technology & Engineering

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and ...

Author: Vasilis F. Pavlidis

Publisher: Newnes

ISBN: 9780124104846

Category: Technology & Engineering

Page: 768

View: 171

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Categories: Technology & Engineering

High Speed Optical Transceivers

High Speed Optical Transceivers

worldScientific.com International Journal of High Speed Electronics and Systems W. ... COMMUNICATIONS ICS USING INP-BASED HBT TECHNOLOGIES Kiyoshi ISHII, ...

Author:

Publisher:

ISBN: 9789814478700

Category:

Page:

View: 873

Categories:

CMOS Analog Integrated Circuits

CMOS Analog Integrated Circuits

The book details all aspects, from specification to the final chip, of the development and implementation process of filters, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), phase-locked loops (PLLs), and delay ...

Author: Tertulien Ndjountche

Publisher: CRC Press

ISBN: 1138076856

Category:

Page: 926

View: 231

High-speed, power-efficient analog integrated circuits can be used as standalone devices or to interface modern digital signal processors and micro-controllers in various applications, including multimedia, communication, instrumentation, and control systems. New architectures and low device geometry of complementary metaloxidesemiconductor (CMOS) technologies have accelerated the movement toward system on a chip design, which merges analog circuits with digital, and radio-frequency components. CMOS: Analog Integrated Circuits: High-Speed and Power-Efficient Design describes the important trends in designing these analog circuits and provides a complete, in-depth examination of design techniques and circuit architectures, emphasizing practical aspects of integrated circuit implementation. Focusing on designing and verifying analog integrated circuits, the author reviews design techniques for more complex components such as amplifiers, comparators, and multipliers. The book details all aspects, from specification to the final chip, of the development and implementation process of filters, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), phase-locked loops (PLLs), and delay-locked loops (DLLs). It also describes different equivalent transistor models, design and fabrication considerations for high-density integrated circuits in deep-submicrometer process, circuit structures for the design of current mirrors and voltage references, topologies of suitable amplifiers, continuous-time and switched-capacitor circuits, modulator architectures, and approaches to improve linearity of Nyquist converters. The text addresses the architectures and performance limitation issues affecting circuit operation and provides conceptual and practical solutions to problems that can arise in the design process. This reference provides balanced�coverage of theoretical and practical issues that will allow the reader to design CMOS analog integrated circuits with improved electrical performance. The chapters contain easy-to-follow mathematical derivations of all equations and formulas, graphical plots, and open-ended design problems to help determine most suitable architecture for a given set of performance specifications. This comprehensive and illustrative text for the design and analysis of CMOS analog integrated circuits serves as a valuable resource for analog circuit designers and graduate students in electrical engineering.
Categories:

Advances in Analog and RF IC Design for Wireless Communication Systems

Advances in Analog and RF IC Design for Wireless Communication Systems

This book offers a quick grasp of emerging research topics in RF integrated circuit design and their potential applications, with brief introductions to key topics followed by references to specialist papers for further reading.

Author: Gabriele Manganaro

Publisher: Academic Press

ISBN: 9780123983329

Category: Technology & Engineering

Page: 320

View: 964

Advances in Analog and RF IC Design for Wireless Communication Systems gives technical introductions to the latest and most significant topics in the area of circuit design of analog/RF ICs for wireless communication systems, emphasizing wireless infrastructure rather than handsets. The book ranges from very high performance circuits for complex wireless infrastructure systems to selected highly integrated systems for handsets and mobile devices. Coverage includes power amplifiers, low-noise amplifiers, modulators, analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), and even single-chip radios. This book offers a quick grasp of emerging research topics in RF integrated circuit design and their potential applications, with brief introductions to key topics followed by references to specialist papers for further reading. All of the chapters, compiled by editors well known in their field, have been authored by renowned experts in the subject. Each includes a complete introduction, followed by the relevant most significant and recent results on the topic at hand. This book gives researchers in industry and universities a quick grasp of the most important developments in analog and RF integrated circuit design. Emerging research topics in RF IC design and its potential application Case studies and practical implementation examples Covers fundamental building blocks of a cellular base station system and satellite infrastructure Insights from the experts on the design and the technology trade-offs, the challenges and open questions they often face References to specialist papers for further reading
Categories: Technology & Engineering