Handbook of Deposition Technologies for Films and Coatings

Science, Applications and Technology

Author: Peter M. Martin

Publisher: William Andrew

ISBN: 0815520328

Category: Technology & Engineering

Page: 936

View: 5304

DOWNLOAD NOW »

This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications. * Explains in depth the many recent i
Release

Handbook of Deposition Technologies for Films and Coatings

Science, Technology, and Applications

Author: Rointan Framroze Bunshah

Publisher: William Andrew

ISBN: 0815513372

Category: Reference

Page: 861

View: 2190

DOWNLOAD NOW »

This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well as Metallurgical Coating Applications.
Release

Handbook of Deposition Technologies for Films and Coatings, 2nd Ed.

Science, Applications and Technology

Author: Rointan F. Bunshah

Publisher: William Andrew

ISBN: 0815517467

Category: Technology & Engineering

Page: 887

View: 1721

DOWNLOAD NOW »

This second edition, edited by the world-renowned Dr. Rointain Bunshah, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. Considerably more material was added in Plasma Assisted Vapor Deposition processes, as well as Metallurgical Coating Applications.
Release

Handbook of Sputter Deposition Technology

Fundamentals and Applications for Functional Thin Films, Nano-materials and MEMS

Author: Kiyotaka Wasa,Isaku Kanno,Hidetoshi Kotera

Publisher: William Andrew

ISBN: 1437734839

Category: Science

Page: 644

View: 9639

DOWNLOAD NOW »

Sputtering is a Physical Vapor Deposition vacuum process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when an ionized gas molecule is used to displace atoms of a specific material. These atoms then bond at the atomic level to a substrate and create a thin film. Several types of sputtering processes exist, including: ion beam, diode, and magnetron sputtering. Cathode sputtering is widely used in the microelectronics industry for silicon integrated circuit production and for metallic coatings. High temperature, diamond films and ferroelectric materials are other applications. Sputtering applications are important across a wide range of industries, including the automotive, medical, semiconductors, space, plastics, and military sectors. A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available. All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique. 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere.
Release

Handbook of Hard Coatings

Deposition Technolgies, Properties and Applications

Author: Rointan F. Bunshah,Christian Weissmantel

Publisher: Cambridge University Press

ISBN: 9780815514381

Category: Science

Page: 550

View: 1455

DOWNLOAD NOW »

Written by 12 leading experts, this is an essential resource for fabrication, characterization and applications in the field of hard coatings and wear resistant surfaces. Offering complete explanations of commercially oriented deposition technology, from traditional vacuum. Includes a detailed introduction to the science of characterizing and measuring hard coatings.
Release

Handbook of Thin Film Deposition

Author: Krishna Seshan

Publisher: William Andrew

ISBN: 1437778747

Category: Technology & Engineering

Page: 408

View: 914

DOWNLOAD NOW »

The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films. A practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance and applications Covers core processes and applications in the semiconductor industry and new developments in the photovoltaic and optical thin film industries The new edition takes covers the transition taking place in the semiconductor world from Al/SiO2 to copper interconnects with low-k dielectrics Written by acknowledged industry experts from key companies in the semiconductor industry including Intel and IBM Foreword by Gordon E. Moore, co-founder of Intel and formulator of the renowned ‘Moore’s Law’ relating to the technology development cycle in the semiconductor industry
Release

Handbook of Vacuum Arc Science & Technology

Fundamentals and Applications

Author: Raymond L. Boxman,David M. Sanders,Philip J. Martin

Publisher: William Andrew

ISBN: 0815517793

Category: Technology & Engineering

Page: 773

View: 3327

DOWNLOAD NOW »

This is a comprehensive text describing the basic physics and technological applications of vacuum arcs. Part I describes basic physics of the vacuum arc, beginning with a brief tutorial review of plasma and electrical discharge physics, then describes the arc ignition process, cathode and anode spots which serve as the locus for plasma generation, and resultant interelectrode plasma. Part II describes the applications of the vacuum arc for depositing thin films and coatings, refining metals, switching high power, and as sources of intense electron, ion, plasma, and x-ray beams.
Release

Handbook of Industrial Refractories Technology

Principles, Types, Properties and Applications

Author: Stephen Caniglia,Gordon L. Barna

Publisher: William Andrew

ISBN: 0815517564

Category: Technology & Engineering

Page: 650

View: 5637

DOWNLOAD NOW »

Encompasses the entire range of industrial refractory materials and forms: properties and their measurement, applications, manufacturing, installation and maintenance techniques, quality assurance, and statistical process control.
Release

Handbook of VLSI Microlithography

Principles, Technology and Applications

Author: William B. Glendinning,John N. Helbert

Publisher: William Andrew

ISBN: 1437728227

Category: Technology & Engineering

Page: 671

View: 7889

DOWNLOAD NOW »

This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Release